KaiFeng Park

2nd Floor,Bao'an , SZ

Phone Number

(+86)181 7910 9874

FUJI XPF-W SMT Placement Machine Multi-Functional PCB Production Dual-Lane Efficiency ±0.025mm Accuracy

Device Dimensions (WDH): 1500mm x 1625mm x 1422.5mm
Device Weight: 1,500kg
Power Supply Requirements: Three-phase AC200V~420V/50/60HZ /3kVA
Air Source Requirements: 0.5±0.05Mpa

Description

Device Introduction: 
It can automatically replace the mounting working head during production, achieving the automatic replacement of the working head. Since it can automatically switch from a high-speed working head to a multi-functional working head while the machine is running, all components can always be mounted with the appropriate working head. It can also automatically replace the working head for applying the adhesive. Just one machine can be used for both applying the adhesive and mounting components. There is no need to worry about the balance between the high-speed machine and the multi-functional machine. By realizing the automatic replacement of the working head, the boundary between the high-speed machine and the multi-functional machine is eliminated (no boundary). For all types of circuit boards, as the balance between the machines is always maintained in an optimal state, the capabilities of the machine can be maximized.

FUJI XPF Series SMT Placement Machine

Product Detail

FUJI XPF Series SMT Placement Machine Technical Specifications

ParameterDetails
PCB Size (L×W)MAX: 686mm × 508mm
MIN: 50mm × 50mm
Board Loading Time1.8 seconds
Component PackagingTape (JIS/JEITA), Tray, Tube
Placement AccuracyQFP Components: ±0.040mm (Cpk≥1.00) ~ ±0.053mm (Cpk≥1.33)
Placement Speed4 Nozzles: 0.351 sec/component (10,250 CPH)
2 Nozzles: 0.462 sec/component (7,800 CPH)
Component Range4 Nozzles: 3×3mm ~ 14×14mm (Height ≤6.5mm)
2 Nozzles: 14×14mm ~ 22×26mm (Height ≤6.5mm)
Nozzle Quantity12 (Revolver Auto-Tool Head)
Auto-Head Change Capacity2

Additional Configurations

Model/FeatureSpecifications
Small Chip ComponentsComponent Size: 0402 (01005) ~ 20×20mm (Height ≤3.0mm)
Placement Speed0.144 sec/component (25,000 CPH)
Placement AccuracySmall Chips: ±0.050mm (Cpk≥1.00) ~ ±0.066mm (Cpk≥1.33)
QFP: ±0.040mm (Cpk≥1.00) ~ ±0.053mm (Cpk≥1.33)
Nozzle Quantity1 (Single Nozzle)
Auto-Head Storage6 (Including 1 height-measuring head for tray components)
Large Component SupportComponent Size: 1005 (0402) ~ 45×150mm (68×68mm)
Height: ≤25.4mm
Placement Speed0.400 sec/component (9,000 CPH)
Placement AccuracySmall Chips: ±0.040mm (Cpk≥1.00) ~ ±0.053mm (Cpk≥1.33)
QFP: ±0.030mm (Cpk≥1.00) ~ ±0.040mm (Cpk≥1.33)
Nozzle Quantity4 (M4 Auto-Tool Head)
Auto-Head Storage1