Optical System Imaging Method Dynamic Imaging or Stop-and-Go on select configurations Top Camera 4 or 9 or 12 Mpix high speed color camera (factory setting) Angle Camera N/A Imaging Resolution 6 µm, 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology N/A Max. 3D Range N/A Inspection Performance Imaging Speed 4 Mpix@ 10 µm Dynamic Imaging: 60 cm²/sec 4 Mpix@ 15 µm Dynamic Imaging: 120 cm²/sec 9 Mpix@ 10 µm Dynamic Imaging: 72 cm²/sec 12 Mpix@ 6 µm Dynamic Imaging: 40 cm²/sec 4 Mpix@ 10 µm Stop-and-Go: 4.5 FOV/sec 4 Mpix@ 15 µm Stop-and-Go: 4.5 FOV/sec Motion Table & Control X-Axis Control Ballscrew + AC-servo controller Y-Axis Control Ballscrew + AC-servo controller Z-Axis Control N/A X-Y Axis Resolution 1 µm Board Handling Max PCB Size TR7700 SII Plus@ 10 µm, 15 µm: 510 x 460 mm TR7700 SII Plus@ 6 µm: 400 x 400 mm TR7700 SII Plus DL@ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane TR7700 SII Plus DL@ 6 µm: 400 x 310 mm x 2 lanes, 400 x 400 mm x 1 lane PCB Thickness 0.6-5 mm Max PCB Weight 3 kg Top Clearance 10 µm, 15 µm: 25 mm [48 mm optional◎※] 6 µm: 25 mm ◎The air blow module does not apply to this option ※This option is only available for 4 Mpix camera. Bottom Clearance 10 µm, 15 µm: 40 mm [100 mm optional] 6 µm: 40 mm Edge Clearance 3 mm [5 mm optional] Conveyor Inline Height: 880 – 920 mm * SMEMA Compatible Inspection Functions Component Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Solder Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination Dimensions WxDxH TR7700 SII Plus: 1000 x 1400 x 1650 mm TR7700 SII Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 520 mm Weight TR7700 SII Plus: 600 kg TR7700 SII Plus DL: 650 kg

TR7700 SII Plus Automated Optical Inspection (AOI)

The World’s First Hybrid AOI: TR7700 SII Plus
Utilizing a new hybrid inspection design, the TR7700 SII Plus can leverage both stop-and-go strategy and dynamic imaging to achieve optimal inspection performance on all types of PCBAs, e.g.: Inspection Cycle Time Reduction. Simply switch the inspection mode to determine the best approach for your product.

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Description

• Flexible Stop-and-Go or Dynamic Imaging AOI

• Intelligent Easy Programming Interface

• Rapid Changeover with Intelligent Auto Conveyor

• Foreign Material and Extra Component Inspection

• 6 µm or 10 μm or 15 μm resolution

Optical System

Imaging Method	Dynamic Imaging or Stop-and-Go on select configurations
Top Camera	4 or 9 or 12 Mpix high speed color camera (factory setting)
Angle Camera	N/A
Imaging Resolution	6 µm, 10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	N/A
Max. 3D Range	N/A

Inspection Performance

Imaging Speed

4 Mpix@ 10 µm Dynamic Imaging: 60 cm²/sec
4 Mpix@ 15 µm Dynamic Imaging: 120 cm²/sec
9 Mpix@ 10 µm Dynamic Imaging: 72 cm²/sec
12 Mpix@ 6 µm Dynamic Imaging: 40 cm²/sec
4 Mpix@ 10 µm Stop-and-Go: 4.5 FOV/sec
4 Mpix@ 15 µm Stop-and-Go: 4.5 FOV/sec

Motion Table & Control

X-Axis Control	Ballscrew + AC-servo controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	N/A
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7700 SII Plus@ 10 µm, 15 µm: 510 x 460 mm TR7700 SII Plus@ 6 µm: 400 x 400 mm TR7700 SII Plus DL@ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane TR7700 SII Plus DL@ 6 µm: 400 x 310 mm x 2 lanes, 400 x 400 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	10 µm, 15 µm: 25 mm [48 mm optional◎※] 6 µm: 25 mm ◎The air blow module does not apply to this option ※This option is only available for 4 Mpix camera.
Bottom Clearance	10 µm, 15 µm: 40 mm [100 mm optional] 6 µm: 40 mm
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700 SII Plus: 1000 x 1400 x 1650 mm TR7700 SII Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7700 SII Plus: 600 kg TR7700 SII Plus DL: 650 kg

KaiFeng Park

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