Optical System Imaging Method Dynamic Imaging with true 3D profile measurement Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm (factory setting) Lighting Multi-phase RGB+W LED 3D Technology Single/Dual 3D laser sensors Max. 3D Range 20 mm Inspection Performance Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec 4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec* 4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec* * Depending on board size and laser resolution Motion Table & Control X-Axis Control Ballscrew + AC-servo controller Y-Axis Control Ballscrew + AC-servo controller Z-Axis Control N/A X-Y Axis Resolution 1 µm Board Handling Max PCB Size TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane PCB Thickness 0.6-5 mm Max PCB Weight 3 kg Top Clearance 25 mm Bottom Clearance 40 mm Edge Clearance 3 mm [5 mm optional] Conveyor Inline Height: 880 – 920 mm * SMEMA Compatible Inspection Functions Component Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component Solder Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination Dimensions WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1630 x 1655 mm TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm Weight TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg TR7700 SIII 3D DL: 1150 kg

Automated Optical Inspection (AOI)

TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Description

• High Speed 2D + 3D Inspection of Up to 01005 Components
• High Defect Coverage Using Hybrid 2D + 3D Inspection Technology
• True 3D Profile Measurement Using Dual Laser Units
• Intelligent Rapid Programming Interface with Auto Library and Offline Editing

Optical System

Imaging Method	Dynamic Imaging with true 3D profile measurement
Top Camera	4 Mpix
Angle Camera	N/A
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	Single/Dual 3D laser sensors
Max. 3D Range	20 mm

Inspection Performance

Imaging Speed

4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*

* Depending on board size and laser resolution

Motion Table & Control

X-Axis Control	Ballscrew + AC-servo controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	N/A
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	25 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1630 x 1655 mm TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg TR7700 SIII 3D DL: 1150 kg

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